| Process | entry | Mass manufacturing capabilities | |
| SMT | printing | Maximum PCB size can be machined | 510*510mm |
| Maximum plate mass | 5kg | ||
| Actual printing accuracy | ±18μm（6σ） | ||
| System calibration repeatability | ±12.5μm（6σ） | ||
| Scraper pressure detection | Pressure closed-loop control system | ||
| SMD | Minimum solder ball spacing can be detected | 100μm | |
| X-Y axis accuracy | 10μm | ||
| False detection rate | ≤0.1% (depending on product) | ||
| A range of machinable component sizes | 0.3*0.15 mm²--120*90 mm² (under specified conditions) | ||
| The maximum height of the component that can be machined | 30mm | ||
| Maximum quality of machinable components | 30g | ||
| BGA/CSP minimum ball pitch, ball diameter | 0.30mm，0.25mm | ||
| SMD accuracy | ±30μm（3σ） | ||
| A range of machinable plate sizes | 50*50 mm²—750*550 mm² | ||
| Plate thickness range | 0.3mm--8mm | ||
| Maximum plate mass | 3kg | ||
| The line body can hold up to the material type | 500 | ||
| AOI | Detects the smallest components | 1005 | |
| Detectable for adverse conditions | Wrong material, missing parts, reverse, placement offset, standing monument, side stand, open welding, connecting tin, flipping | ||
| Foot cocking detection | Pin bending | ||
| Reflux | Temperature accuracy | ±1℃ | |
| Welding protection | Nitrogen protection (residual oxygen < 3000ppm) (under specified conditions) | ||
| Nitrogen control | Nitrogen closed-loop automatic control system, ± 200ppm | ||
| 2D X-Ray | Magnification | Geometric magnification 2000; System magnification 12000 | |
| resolution | 1μm /nm | ||
| Rotation angle & tilt viewing angle | Any ± 45°+360° rotation | ||
| AXI | Detects the smallest components | 1005 | |
| Minimum pin spacing can be detected | 0.4mm（QFP） | ||
| Minimum tin thickness can be detected | 0.0127mm | ||
| DIP | Pre-processing | Automatic component molding technology | Components are automatically formed |
| Plugins | Plug-in technology | Fully automatic plug-in machine | |
| Wave soldering | Crest type | Popo | |
| Transportation rail inclination | 4--7° | ||
| Pressure welding temperature accuracy | ±3℃ | ||
| Wave selection peak stabilization accuracy | ±0.06 mm | ||
| Crimping technology | Maximum size of crimp PCB | 800*600mm² | |
| Downward pressure height accuracy | ±0.02mm | ||
| Pressure range | 0-50KN | ||
| Pressure accuracy | ±2% of standard value | ||
| Holding time | 0—9.999S | ||
| Coating technology | Maximum machinable plate size | 450*450*6mm³ | |
| Veneer maximum mass | 5kg | ||
| Minimum nozzle diameter | 2mm | ||
| Other features | The spray pressure can be programmed to control | ||
| ICT testing | Test level | Device-level testing to test hardware connection status | |
| Number of test points | > 2500 points | ||
| Test the content | Contact test, open and short circuit test, resistance capacitance test, secondary and tertiary FET test, unpowered hybrid test, boundary scan chain test, power-on mixed mode test | ||
| Washing | Maximum width of the plate | 457.2mm | |
| Maximum height of the plate | 102mm | ||
| Device capabilities | Single\double hurricane jet, S-type nozzle, electric air knife | ||
| Assembly and testing | Product family | Military | Armament |
| Automotive products | Light board, motherboard | ||
| Medical products | CT, CT probe, temperature measurement, medical monitor | ||
| FT test | Test level | Board system-level testing to test the functional status of the system | |
| Other reliability analysis tests | Aging, dropping, vibration, wear resistance, key life and other tests (third party) | ||
| Management tools/software | IMS | Assist warehouse, material preparation group, production for material management | |
| MES | Manufacturing execution system, mainly used for production process control, ECN execution control, foolproof control, data traceability, etc | ||
| Oracle | Procurement process, cost, finance, work order planning and other management | ||
| ECN System | ECN management system to avoid missing ECN and quickly respond to engineering change projects | ||
| Labview | Provide a graphical programming environment to enhance the data collection, analysis, monitoring and management capabilities of equipment and instruments in the manufacturing process, and at the same time make the communication of each terminal computer closer and facilitate system construction | ||
